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| LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only INFRARED EMITTING DIODES Pb Lead-Free Parts LHIR3331-PF DATA SHEET DOC. NO : REV. DATE : : QW0905- LHIR3331-PF B 08 - Mar. - 2007 LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO. LHIR3331-PF Page 1/7 Package Dimensions 5.0 5.9 7.6 8.6 1.5MAX 25.0MIN 0.5 TYP 1.0MIN 2.54TYP + - Note : 1.All dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Features: 1. High radiant intensity. 2. Suitable for pulsed applications. 3. Low average degradation. Descriptions: The LHIR3331-PFseries are high power solution grown efficiency Gallium Arsenide infrared emitting diodes encapsulated in blue transparent plastic T-1 3/4 package individually Device Selection Guide: PART NO LHIR3331-PF MATERIAL GaAIAs/GaAs LENS COLOR Blue Transparent LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LHIR3331-PF Page 2/7 Absolute Maximum Ratings at Ta=25 Ratings Parameter Symbol HIR Forward Current Peak Forward Current (300PPS,10s Pulse) Power Dissipation Reverse Voltage Electrostatic Discharge Operating Temperature Storage Temperature IF IFP PD Vr ESD Topr Tstg 50 1 100 5 UNIT mA A mW V 2000 -40 ~ +85 -40 ~ +85 V Electrical Optical Characteristics (Aa=25) PARAMETER Radiant Intensity Aperture Radiant Incidence Peak Emission Wavelength Spectral Line Half Width Forward Voltage Reverse Current Viewing Angle SYMBOL Le Ee Min. 17 2.4 Typ. 29 4.1 850 50 1.2 Max. UNIT mW/sr mW/cm nm nm 2 TEST CONDITION IF=20mA IF=20mA IF=20mA IF=20mA IF=20mA VR=5V peak VF IR 21/2 1.6 100 V A deg 20 Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The radiant intensity data did not including 15% testing tolerance. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LHIR3331-PF Page3/7 Typical Electro-Optical Characteristics Curve HIR CHIP Fig.1 Forward Current vs. Rorward Voltage 1000 Fig.2 Relative Radiant Power vs. Wavelength 1.0 100 10 1 0.1 0.0 Relative Radiant Power Normalize @20mA Forward Current[mA] 0.5 1.0 2.0 3.0 4.0 0.0 800 850 900 950 Forward Voltage[V] Wavelength[nm] Fig.3 Relative Radiant Power vs. Forward DC Current 10.0 Fig.4 Relative Radiant Power vs. Forward Peak Current 10.0 Relative Radiant Power Normalize @20mA 1.0 Relative Radiant Power Normalize @100 mA 1 10 100 1.0 0.1 0.1 10 100 1000 IFDC[mA] IFPK[mA] Fig.5 Forward DC Voltage vs. Temperature 1.2 Fig.6 Relative Radiant Power vs. Temperature 3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 Forward DC Voltage Normalize @20mA, 25 1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100 Relative Radiant Power Normalize @ 20mA, 25 -20 0 20 40 60 80 100 Ambient Temperature[] Ambient Temperature[] LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LHIR3331-PF Page 4/7 Storage time: 1.The operation of Temperatures and RH are : 5 ~35,RH<60%. 2.Once the package is opened, the products should be used within a week. Otherwise, they should be kept in a damp proof box with descanting agent. Considering the tape life, we suggest our customers to use our products within a year(from production date). 3.If opened more than one week in an atmosphere 5 ~ 35,RH<60%, they should be treated at 605 fo r 15hrs. Drive Method: LED is a current operated device, and therefore, require some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forwrd current should not be allowed to change by more than 40 % of its desired value. Circuit model A LED Circuit model B LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LHIR3331-PF Page 5/7 Mounting: 1. If the leads are subjected to stress during soldering a printed circuit board, illumination failure may result immediately or later during use. For this reason, make sure that the intervals between the installation holes in the board are equal to the intervals between the leads (after forming if done) so that no stress is applied to the lead. (O) (O) (X) 2. The LED lamps are designed for high-density mounting and have a structure which can alleviate mechanical stress due to clinching . Nevertheless , take care to avoid the occurrence of residual mechanical stress due to clinching . 15 45 Anode side(cathode side on GaAlAs chips) LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LHIR3331-PF Page 6/7 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350C Max Soldering Time:3 Seconds Max(One time only) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp( C) 260 C3sec Max 260 5 /sec max 120 2 /sec max Preheat 60 Seconds Max 25 0 0 50 100 150 Time(sec) Note: 1.Wave solder should not be made more than one time. 2.You can just only select one of the soldering conditions as above. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only PART NO.LHIR3331-PF Page 7/7 Reliability Test: Test Item Test Condition 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) Description This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Operating Life Test High Temperature Storage Test 1.Ta=85 5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 Low Temperature Storage Test 1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 7021: B-12 High Temperature High Humidity Test 1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 Thermal Shock Test 1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 Solder Resistance Test 1.T.Sol=260 5 2.Dwell time= 10 1sec. MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 Solderability Test 1.T.Sol=230 5 2.Dwell time=5 1sec This test intended to see soldering well performed or not. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 |
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